Unleash EDA Potential with AMD, Azure, and Ansys

Azure provides a flexible and scalable EDA environment, with a variety of HPC services and resources to meet the demanding requirements of electronic design workflows. InfiniBand interconnect is one such service.

Come learn about a collaborative innovation involving AMD, Azure, and Ansys that focuses on harnessing Azure’s InfiniBand-based storage solution to overcome the limitations of traditional NFS-based compute grid. By combining the power of Azure’s cloud infrastructure with Ansys’ Redhawk-SC, AMD EPYC Processors; chip designers can accelerate their design iterations and achieve optimized results for complex electronic systems.

Azure provides a flexible and scalable EDA environment, with a variety of HPC services and resources to meet the demanding requirements of electronic design workflows. InfiniBand interconnect is one such service.

Come learn about a collaborative innovation involving AMD, Azure, and Ansys that focuses on harnessing Azure’s InfiniBand-based storage solution to overcome the limitations of traditional NFS-based compute grid. By combining the power of Azure’s cloud infrastructure with Ansys’ Redhawk-SC, AMD EPYC Processors; chip designers can accelerate their design iterations and achieve optimized results for complex electronic systems.